A TRM Based Layer-level Thermal Analysis Simulation of a Typical PCB with Vias and Joule heating

Abstract : – Space heat transfer boundary conditions and with uneven distribution of copper content in the tracks of different layers of a PCB along with thermally filled vias spread across different locations of the PCB have been accounted for. Here an accurately geometrically modelled ECAD file of the PCB was imported into TRM’s Software […]

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Propulsion Systems for Future

During more than 40 years of spaceflight, a lot of things have changed. Today’s Space Shuttle is a luxury ship compared to the Mercury capsules that carried the first American astronauts into space. Forty years ago, a lot of people might have had a hard time believing that Americans and Russians would be living together […]

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